| 发明名称 |
ELECTRONIC DEVICE PACKAGE AND SEALING SHEET |
| 摘要 |
An electronic device package which is provided with a body to be sealed and a sealing layer that seals the body to be sealed. The body to be sealed has a portion that is not in contact with the sealing layer at least in a part of the upper surface or the lateral surface of the body to be sealed. |
| 申请公布号 |
WO2016092964(A1) |
申请公布日期 |
2016.06.16 |
| 申请号 |
WO2015JP80420 |
申请日期 |
2015.10.28 |
| 申请人 |
NITTO DENKO CORPORATION |
发明人 |
ISHII, JUN;SHIGA, GOJI;ISHIZAKA, TSUYOSHI;IINO, CHIE |
| 分类号 |
H01L23/04;H01L23/28;H03H9/25 |
主分类号 |
H01L23/04 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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