| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate processing apparatus which can detect a mounting condition of a substrate by a simple constitution.SOLUTION: A substrate processing apparatus has a heat treatment unit U2 which includes: a supporter 28 for supporting a wafer W; and a lifting mechanism 30 which has a plurality of lifting pins 31 and in which the wafer W on the supporter 28 is lifted up and lowered by the plurality of lifting pins 31; and a detection mechanism 60 for detecting a mounting condition of the wafer W based on information relevant to timing of switching between a contact condition and a non-contact condition of at least one of the plurality of lifting pins 31 with the wafer W.SELECTED DRAWING: Figure 4 |
