ENCAPSULATED SEMICONDUCTOR DEVICE AND ENCAPSULATION METHOD

摘要

The present invention relates to an encapsulated semiconductor device (20) provided on a flexible substrate (1), a method of providing an at least partially encapsulated semiconductor device (20) on a flexible substrate (1) and a software product for providing an at least partially encapsulated semiconductor device (20) on a flexible substrate (1). In a preferred embodiment, an encapsulation method is presented in which the organic layer (3) of an inorganic/organic/inorganic multilayer barrier (5) on a plastic foil (1) as a substrate is removed at the edges of an OLED (13). The edges are subsequently sealed with a standard TFE process to encapsulate the OLED (13). This enables cuttable OLEDs (20) that are cut out of a larger plastic substrate (1) and gives a method to reduce side leakage in OLEDs (20) that have been manufactured in a roll-to-toll process.

主权项

1. An encapsulated semiconductor device comprising a flexible substrate and a semiconductor arrangement provided on the flexible substrate,
wherein a barrier layer is provided between the semiconductor arrangement and the flexible substrate and an encapsulation layer is provided at least partially covering the semiconductor arrangement, wherein the barrier layer successively comprises, in a direction from the flexible substrate towards the semiconductor arrangement, an outer inorganic barrier layer, an organic barrier layer and an inner inorganic barrier layer, wherein the encapsulation layer includes an outer inorganic encapsulation layer, an organic encapsulation layer and an inner inorganic encapsulation layer in this order; wherein the outer inorganic barrier layer extends beyond the organic barrier layer and a lateral surface of the organic encapsulation layer and the outer inorganic encapsulation layer abuts a main surface of the outer inorganic barrier layer opposite the substrate; wherein the organic barrier layer extends beyond the inner inorganic barrier layer and a lateral surface of the inner inorganic encapsulation layer of the encapsulation layer abuts a main surface of the organic barrier layer opposite the substrate, a lateral surface of the organic barrier layer abutting a main surface of the organic encapsulation layer opposite the outer inorganic encapsulation layer.