发明名称 |
Semiconductor sensor and method of producing sensor body for semiconductor sensor |
摘要 |
A semiconductor sensor having a reduced thickness and a method of producing a sensor body for the semiconductor sensor. The length (L1) in the direction in which the center line (C) of a portion at which a weight section (5) and an additional weight section (3) are joined is set less than the length (L2) in the direction in which the center line (C) of a support section (7) extends. The weight section (5) and the additional weight section (3) are received in a space (15) surrounded by the support section (7). The weight section (5) and the additional weight section (3) are formed in dimensions and shapes that enable them to move in the space (15). |
申请公布号 |
GB2447386(A) |
申请公布日期 |
2008.09.10 |
申请号 |
GB20080011733 |
申请日期 |
2006.12.20 |
申请人 |
HOKURIKU ELECTRIC INDUSTRY CO.,LTD. |
发明人 |
TSUTOMU SAWAI;KAZUYA KOMORI |
分类号 |
G01P15/08;G01P15/02;G01P15/12;H01L29/84 |
主分类号 |
G01P15/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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