| 摘要 |
A wiring substrate includes a plurality of lines provided on the substrate, and a plurality of mounting terminals each for respective one of the plurality of lines, the plurality of mounting terminals being arranged in several rows in a staggered pattern, wherein the mounting terminal includes a first conductive film formed in the same layer as the lines, an insulating film covering the lines and the first conductive film, the insulating film having an opening above the first conductive film, and an upper layer conducive film electrically connected to the first conductive film through the opening, and wherein the insulating film includes a thick film portion located on the outside of the area where the plurality of mounting terminals are arranged in several rows in the staggered pattern, and a thin film portion located in the area adjacent to the opening in the row direction of the staggered pattern with a thickness thinner than the thick film portion.
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