| 摘要 |
A multilayer wiring board (1) of the present invention provided in a camera module has a sandwiched wiring layer (13) between opened wiring layers (11) having openings (12). The openings (12) formed in the opened wiring layers (11) form a through hole (12a) which penetrates the opened wiring layer (11) in the direction in which the opened wiring layers (11) are stacked on top of each other. The sandwiched wiring layer (13) overlaps at least part of the opening (12) of the opened wiring layer (11) and has a blocking section (13a) which blocks the through hole (12a). Therefore, it is possible to mitigate thermal stress applied to the multilayer wiring board, while maintaining the freedom of wiring design.
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