发明名称 |
PRINTED CIRCUIT BOARD WITH EMBEDDED ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME |
摘要 |
A printed circuit board with embedded electronic component and a method of manufacturing the same are provided. The method of manufacturing a printed circuit board involves processing a cavity in a core substrate, attaching a support to one surface of the core substrate, inserting an electronic component into the cavity, affixing the electronic component to a side wall of the cavity by use of a liquid adhesive, removing the support, and stacking an insulation layer and a copper thin layer simultaneously on both surfaces of the core substrate. |
申请公布号 |
US2016165732(A1) |
申请公布日期 |
2016.06.09 |
申请号 |
US201514955523 |
申请日期 |
2015.12.01 |
申请人 |
Samsung Electro-Mechanics Co., Ltd. |
发明人 |
MOON Myeong-Dae;JUNG Byung-Sub |
分类号 |
H05K1/18;H05K3/30 |
主分类号 |
H05K1/18 |
代理机构 |
|
代理人 |
|
主权项 |
1. A printed circuit board comprising:
a core substrate having a cavity formed therein; an electronic component embedded in the cavity; and an adhesive layer affixing the electronic component to a side wall of the cavity. |
地址 |
Suwon-si KR |