发明名称 PRINTED CIRCUIT BOARD WITH EMBEDDED ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME
摘要 A printed circuit board with embedded electronic component and a method of manufacturing the same are provided. The method of manufacturing a printed circuit board involves processing a cavity in a core substrate, attaching a support to one surface of the core substrate, inserting an electronic component into the cavity, affixing the electronic component to a side wall of the cavity by use of a liquid adhesive, removing the support, and stacking an insulation layer and a copper thin layer simultaneously on both surfaces of the core substrate.
申请公布号 US2016165732(A1) 申请公布日期 2016.06.09
申请号 US201514955523 申请日期 2015.12.01
申请人 Samsung Electro-Mechanics Co., Ltd. 发明人 MOON Myeong-Dae;JUNG Byung-Sub
分类号 H05K1/18;H05K3/30 主分类号 H05K1/18
代理机构 代理人
主权项 1. A printed circuit board comprising: a core substrate having a cavity formed therein; an electronic component embedded in the cavity; and an adhesive layer affixing the electronic component to a side wall of the cavity.
地址 Suwon-si KR