GOLD DIE BOND SHEET PREFORM

摘要

The amount of gold required for plating an electronic package for a semiconductor package is reduced by reducing the thickness of the gold plate on the package substrate and using a gold die bond sheet preform. The preform, only slightly larger than a semiconductor die to be attached to the package, is placed in the die bond location and tack welded to the package. The thickness of the gold plating on the package and the preform provide the proper thickness of gold for reliably die bonding the die to the package.