CONTACT ELECTRODE FOR MICRODEVICES AND ETCH METHOD OF MANUFACTURE
摘要
<p>A contact electrode for a device is made using an etching process to etch the surface of the contact electrode to form a corrugated contact surface wherein the outer edges of at least one grain is recessed from the outer edges of adjecent grains and is recessed by at least about 0.05 µm from the contact plane. By having such a corrugated surface, the contact electrode is likely to contact another conductor with at least one pure metal grain. This etching treatment reduces contact resistance and contact resistance variability throughout many cycles of use of the contact electrode.</p>
申请公布号
WO2008045230(A2)
申请公布日期
2008.04.17
申请号
WO2007US21113
申请日期
2007.10.02
申请人
INNOVATIVE MICRO TECHNOLOGY;PARANJPYE, ALOK;THOMPSON, DOUGLAS, L.