ENCAPSULANT FOR PV MODULE, METHOD OF MANUFACTURING THE SAME AND PV MODULE COMPRISING THE SAME (As Amended)

摘要

The present application relates to an encapsulant for a PV module, a method of manufacturing the same and a PV module. The encapsulant according to an embodiment of the present application has excellent heat resistance or the like and improved creep physical properties, and thus even when the encapsulant is used under conditions of a high temperature and/or high humidity for a long time, deformation is small and the encapsulant can exhibit excellent adhesive strength. Accordingly, when the encapsulant is applied to a PV module, durability or the like may be improved.

主权项

1. An encapsulant for a PV module, comprising:
an ethylene/α-olefin-based copolymer; a silane modified ethylene/α-olefin-based copolymer; and a heat resistant polymer resin having a melting point (Tm) higher than the ethylene/α-olefin-based polymer.