发明名称 HIGH-K METAL GATE
摘要 An integrated circuit containing metal replacement gates may be formed by forming a nitrogen-rich titanium-based barrier between a high-k gate dielectric layer and a metal work function layer of a PMOS transistor. The nitrogen-rich titanium-based barrier is less than 1 nanometer thick and has an atomic ratio of titanium to nitrogen of less than 43:57. The nitrogen-rich titanium-based barrier may be formed by forming a titanium based layer over the gate dielectric layer and subsequently adding nitrogen to the titanium based layer. The metal work function layer is formed over the nitrogen-rich titanium-based barrier.
申请公布号 US2016336422(A1) 申请公布日期 2016.11.17
申请号 US201615222262 申请日期 2016.07.28
申请人 Texas Instruments Incorporated 发明人 Niimi Hiroaki;Chambers James Joseph
分类号 H01L29/49;H01L29/51;H01L29/08;H01L21/8238;H01L21/28;H01L21/285;H01L27/092;H01L29/66 主分类号 H01L29/49
代理机构 代理人
主权项 1. An integrated circuit, comprising: a substrate comprising semiconductor material; and a p-channel metal oxide semiconductor (PMOS) transistor, comprising: a high-k gate dielectric layer over said substrate;a nitrogen-rich titanium-based barrier over said high-k gate dielectric layer; anda PMOS metal work function layer over said nitrogen-rich titanium-based barrier, wherein said PMOS metal work function layer is part of a metal gate of said PMOS transistor, wherein the metal gate includes a fill metal layer over the PMOS metal work function layer.
地址 Dallas TX US