发明名称 |
HIGH-K METAL GATE |
摘要 |
An integrated circuit containing metal replacement gates may be formed by forming a nitrogen-rich titanium-based barrier between a high-k gate dielectric layer and a metal work function layer of a PMOS transistor. The nitrogen-rich titanium-based barrier is less than 1 nanometer thick and has an atomic ratio of titanium to nitrogen of less than 43:57. The nitrogen-rich titanium-based barrier may be formed by forming a titanium based layer over the gate dielectric layer and subsequently adding nitrogen to the titanium based layer. The metal work function layer is formed over the nitrogen-rich titanium-based barrier. |
申请公布号 |
US2016336422(A1) |
申请公布日期 |
2016.11.17 |
申请号 |
US201615222262 |
申请日期 |
2016.07.28 |
申请人 |
Texas Instruments Incorporated |
发明人 |
Niimi Hiroaki;Chambers James Joseph |
分类号 |
H01L29/49;H01L29/51;H01L29/08;H01L21/8238;H01L21/28;H01L21/285;H01L27/092;H01L29/66 |
主分类号 |
H01L29/49 |
代理机构 |
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代理人 |
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主权项 |
1. An integrated circuit, comprising:
a substrate comprising semiconductor material; and a p-channel metal oxide semiconductor (PMOS) transistor, comprising:
a high-k gate dielectric layer over said substrate;a nitrogen-rich titanium-based barrier over said high-k gate dielectric layer; anda PMOS metal work function layer over said nitrogen-rich titanium-based barrier, wherein said PMOS metal work function layer is part of a metal gate of said PMOS transistor, wherein the metal gate includes a fill metal layer over the PMOS metal work function layer. |
地址 |
Dallas TX US |