发明名称 METHODS AND APPARATUSES HAVING MEMORY CELLS INCLUDING A MONOLITHIC SEMICONDUCTOR CHANNEL
摘要 Methods for forming a string of memory cells, apparatuses having a string of memory cells, and systems are disclosed. One such method for forming a string of memory cells forms a source material over a substrate. A capping material may be formed over the source material. A select gate material may be formed over the capping material. A plurality of charge storage structures may be formed over the select gate material in a plurality of alternating levels of control gate and insulator materials. A first opening may be formed through the plurality of alternating levels of control gate and insulator materials, the select gate material, and the capping material. A channel material may be formed along the sidewall of the first opening. The channel material has a thickness that is less than a width of the first opening, such that a second opening is formed by the semiconductor channel material.
申请公布号 US2016336341(A1) 申请公布日期 2016.11.17
申请号 US201615221131 申请日期 2016.07.27
申请人 Micron Technology, Inc. 发明人 Sun Jie;Lu Zhenyu;Lindsay Roger W.;Cleereman Brian;Hopkins John;Zhu Hongbin;Simsek-Ege Fatma Arzum;Srinivasan Prasanna;Narayanan Purnima
分类号 H01L27/115;G11C16/04 主分类号 H01L27/115
代理机构 代理人
主权项 1. A method for forming a string of memory cells, the method comprising: forming a plurality of charge storage structures in a plurality of alternating levels of control gate and insulator materials; forming a first opening through the plurality of alternating levels of control gate and insulator materials; and forming a vertical semiconductor material along a sidewall of the opening, the vertical semiconductor material coupled to a source material and adjacent to the plurality of charge storage structures, wherein the plurality of charge storage structures are separated from the vertical semiconductor material by at least a dielectric material and the vertical semiconductor material having a thickness that is less than a width of the first opening such that a second opening is formed by the semiconductor channel material.
地址 Boise ID US