发明名称 |
METHODS AND APPARATUSES HAVING MEMORY CELLS INCLUDING A MONOLITHIC SEMICONDUCTOR CHANNEL |
摘要 |
Methods for forming a string of memory cells, apparatuses having a string of memory cells, and systems are disclosed. One such method for forming a string of memory cells forms a source material over a substrate. A capping material may be formed over the source material. A select gate material may be formed over the capping material. A plurality of charge storage structures may be formed over the select gate material in a plurality of alternating levels of control gate and insulator materials. A first opening may be formed through the plurality of alternating levels of control gate and insulator materials, the select gate material, and the capping material. A channel material may be formed along the sidewall of the first opening. The channel material has a thickness that is less than a width of the first opening, such that a second opening is formed by the semiconductor channel material. |
申请公布号 |
US2016336341(A1) |
申请公布日期 |
2016.11.17 |
申请号 |
US201615221131 |
申请日期 |
2016.07.27 |
申请人 |
Micron Technology, Inc. |
发明人 |
Sun Jie;Lu Zhenyu;Lindsay Roger W.;Cleereman Brian;Hopkins John;Zhu Hongbin;Simsek-Ege Fatma Arzum;Srinivasan Prasanna;Narayanan Purnima |
分类号 |
H01L27/115;G11C16/04 |
主分类号 |
H01L27/115 |
代理机构 |
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代理人 |
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主权项 |
1. A method for forming a string of memory cells, the method comprising:
forming a plurality of charge storage structures in a plurality of alternating levels of control gate and insulator materials; forming a first opening through the plurality of alternating levels of control gate and insulator materials; and forming a vertical semiconductor material along a sidewall of the opening, the vertical semiconductor material coupled to a source material and adjacent to the plurality of charge storage structures, wherein the plurality of charge storage structures are separated from the vertical semiconductor material by at least a dielectric material and the vertical semiconductor material having a thickness that is less than a width of the first opening such that a second opening is formed by the semiconductor channel material. |
地址 |
Boise ID US |