| 发明名称 |
DEVICE PACKAGING FACILITY AND METHOD, AND DEVICE PROCESSING APPARATUS UTILIZING DEHT |
| 摘要 |
Provided are a device packing facility and method using DEHT and a device processing apparatus utilizing the DEHT. The device packaging facility includes a mounting unit providing bis(2-ethylhexyl) terephthalate (DEHT) between first and second devices to attach the first and second devices to each other, a processing unit thermally processing the first and second devices that are attached to each other to remove the DEHT and fix the first and second devices to each other, and a transfer unit transferring the first and second devices that are attached to each other from the mounting unit to the processing unit. |
| 申请公布号 |
US2016336293(A1) |
申请公布日期 |
2016.11.17 |
| 申请号 |
US201615220889 |
申请日期 |
2016.07.27 |
| 申请人 |
SEMIgear, Inc. |
发明人 |
ZHANG Jian;Pinnolis Joshua;Luo Shijian |
| 分类号 |
H01L23/00;H01L21/66 |
主分类号 |
H01L23/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A device packaging method comprising:
providing bis(2-ethylhexyl) terephthalate (DEHT) between first and second devices to attach the first and second devices to each other; thermally processing the first and second devices that are attached to each other to remove the DEHT; and thermally processing the first and second devices to fix the first and second devices to each other. |
| 地址 |
Wakefield MA US |
