发明名称 DIGITAL DATA DEVICE INTERCONNECTS
摘要 Digital data system disposed on a substrate includes a digital data device and at least one digital data interconnect disposed on the substrate. The digital data interconnect is comprised of a plurality of material layers stacked to form a three-dimensional structure. The material layers form a conductive shield, a plurality of straps which are periodically spaced along an interior length of the shield, and a core which includes one or more conductors. The conductors extends along the length of the tubular form parallel to the opposing walls and are suspended on the straps, separated from the conductive shield by an air gap. First and second conductors of the core can facilitate a differential signaling mode.
申请公布号 US2016336263(A1) 申请公布日期 2016.11.17
申请号 US201514709593 申请日期 2015.05.12
申请人 HARRIS CORPORATION 发明人 Shacklette Lawrence W.;Weatherspoon Michael R.;Bruckmeyer Joshua P.;Wilson Arthur
分类号 H01L23/528;H01L21/768 主分类号 H01L23/528
代理机构 代理人
主权项 1. A method for reducing a number of physical data channels required to support a communication bandwidth of a digital data device disposed on a substrate, comprising: forming at least one digital data interconnect by disposing a plurality of material layers on a substrate to define a microstructure which includes a conductive shield disposed on the substrate so as to have a tubular form and extend across a surface of the substrate whereby a signaling channel is defined that is entirely surrounded by a conductive material,a plurality of straps periodically spaced along a length of the tubular form inside the conductive shield, each strap extending between opposing walls of the conductive shield and comprised of a dielectric material, anda core comprising at least one conductor which extends along the length of the tubular form parallel to the opposing walls and suspended on the straps within the conductive shield, with the at least one conductor separated from the conductive shield by an air gap; electrically connecting each of the conductive shield and the at least one conductor of the digital data interconnect to an electrical contact of a first digital data device disposed on the substrate; and communicating digital data from the first digital data device to a second digital data device disposed on the substrate.
地址 Melbourne FL US