Packaging Methods for Semiconductor Devices, Packaged Semiconductor Devices, and Design Methods Thereof

摘要

Packaging methods for semiconductor devices, packaged semiconductor devices, and design methods thereof are disclosed. In some embodiments, a method of packaging a plurality of semiconductor devices includes providing a first die, and coupling second dies to the first die. An electrical connection is formed between the first die and each of the second dies. A portion of each of the electrical connections is disposed between the second dies.

主权项

1. A packaged semiconductor device, comprising:
a first die having a major surface and having an outermost periphery; a second die mounted on the major surface of the first die, the second die partially overlapping within the outermost periphery and partially extending beyond the outermost periphery at a first side of the major surface; another second die mounted on the major surface of the first die, the another second die partially overlapping within the outermost periphery and partially extending beyond the outermost periphery at a second side of the major surface opposite the first side of the major surface; and an electrical interconnect structure disposed between the first die and the second die and the another second die, the electrical interconnect structure extending at least partially in a direction orthogonal to the major surface of the first die and being disposed between the second die and the another second die.