| 发明名称 |
METALLIZATION WITH TAILORABLE COEFFICIENT OF THERMAL EXPANSION |
| 摘要 |
The present invention is directed to an interconnect for an implantable medical device. The interconnect includes a pad and a first layer introduced over the pad. At least one of the pad or the first layer comprise a negative coefficient of thermal expansion (CTE) material. |
| 申请公布号 |
WO2008134615(A3) |
申请公布日期 |
2008.12.24 |
| 申请号 |
WO2008US61738 |
申请日期 |
2008.04.28 |
| 申请人 |
MEDTRONIC, INC.;RUBEN, DAVID A. |
发明人 |
RUBEN, DAVID A. |
| 分类号 |
A61B5/02;A61B5/0215 |
主分类号 |
A61B5/02 |
| 代理机构 |
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代理人 |
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| 地址 |
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