发明名称 固体撮像装置の製造方法
摘要 PROBLEM TO BE SOLVED: To provide a method that can enhance the yield while maintaining the optical characteristic of a solid-state image pickup device having a shading film.SOLUTION: A method of manufacturing a solid-state image pickup device having a pixel part and a peripheral circuit part comprises: a step of forming a first insulation film on the pixel part and the peripheral circuit part; a step of forming a second insulation film on the first insulation film; and a step of etching the second insulation film of a photoelectric conversion part. The method of manufacturing the solid-state image pickup device further comprises a step of forming a metal film on the etched second insulation film of the photoelectric conversion part and the second insulation film of the peripheral circuit part, and a step of removing the metal film of the peripheral circuit part and forming a shading film from the metal film in the photoelectric conversion part.SELECTED DRAWING: Figure 1
申请公布号 JP6039773(B2) 申请公布日期 2016.12.07
申请号 JP20150184488 申请日期 2015.09.17
申请人 キヤノン株式会社 发明人 橋本 浩平;板橋 政次
分类号 H01L27/14;H01L27/146 主分类号 H01L27/14
代理机构 代理人
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