| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a hot melt adhesive applicable at a low temperature, having high heat resistance. <P>SOLUTION: This hot melt adhesive applicable at the low temperature comprises a hot-melt adhesive which is applied at a temperature of≤300°F (149°C), wherein a difference of a thermal-stress value of the bonded adhesive from a temperature at which the adhesive is applied is not more than 110°F (43°C). An adhering method and an adhering apparatus are provided, respectively. The adhesive is preferably applied at a temperature of≤250°F (121°C), more preferably, at a temperature of≤200°F (93°C). <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
