发明名称 |
COPPER ALLOY AND METHOD FOR PRODUCING COPPER ALLOY |
摘要 |
<p>A copper alloy which comprises 5 to 20 % of Sn and the balanced amount of Cu and inevitable impurities and has a structure in which an e phase (Cu<SUB>3</SUB>Sn) is dispersed in an a phase (Cu); and a method for producing a copper alloy which comprises a step of forming a structure in which an e phase (Cu<SUB>3</SUB>Sn) is dispersed in an a phase (Cu). The above copper alloy has a tensile strength sufficient to be free from the deformation or break in the course of the production thereof or in the repeated use thereof, exhibits good spring characteristics, and has high electroconductivity permitting the response to the requirement of a finer lead wire.</p> |
申请公布号 |
WO2006062126(A1) |
申请公布日期 |
2006.06.15 |
申请号 |
WO2005JP22452 |
申请日期 |
2005.12.07 |
申请人 |
KOIKE, JUNICHI;NATIONAL UNIVERSITY CORPORATION TOHOKU UNIVERSITY |
发明人 |
KOIKE, JUNICHI |
分类号 |
C22C9/02;C22F1/00;C22F1/08;H01B1/02;H01B13/00 |
主分类号 |
C22C9/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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