| 摘要 |
Bending wave vibration is used to calculate information relating to a contact on a contact sensitive device. The contact sensitive device has a member capable of supporting bending waves, and a device attached to the member measures bending wave propagation in the member to determine a measured bending wave signal. The measured bending wave signal is processed to calculate information relating to the contact. The contact sensitive device may comprise a transparent touch sensitive plate mounted in front of a display device.
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