发明名称 ELECTRODE PATTERN AND WIRE BONDING METHOD
摘要 An electrode pattern for wire-bonding includes: a wire-bonding reference pattern indicating a reference position for determination of a wire-bonding position; and a wire-bonding recognition pattern. The distance between the reference position and a wire-bonding metal portion bonded to the electrode pattern and the distance between the wire-bonding recognition pattern and the wire-bonding metal portion satisfy predetermined relationships.
申请公布号 US2008230255(A1) 申请公布日期 2008.09.25
申请号 US20080042650 申请日期 2008.03.05
申请人 MITSUBISHI ELECTRIC CORPORATION 发明人 HISA YOSHIHIRO;YAMAGUCHI TSUTOMU;TANAKA HIDEYUKI;MATSUO KAZUNORI
分类号 H01R43/00;H01B5/00 主分类号 H01R43/00
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