发明名称 |
ELECTRODE PATTERN AND WIRE BONDING METHOD |
摘要 |
An electrode pattern for wire-bonding includes: a wire-bonding reference pattern indicating a reference position for determination of a wire-bonding position; and a wire-bonding recognition pattern. The distance between the reference position and a wire-bonding metal portion bonded to the electrode pattern and the distance between the wire-bonding recognition pattern and the wire-bonding metal portion satisfy predetermined relationships.
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申请公布号 |
US2008230255(A1) |
申请公布日期 |
2008.09.25 |
申请号 |
US20080042650 |
申请日期 |
2008.03.05 |
申请人 |
MITSUBISHI ELECTRIC CORPORATION |
发明人 |
HISA YOSHIHIRO;YAMAGUCHI TSUTOMU;TANAKA HIDEYUKI;MATSUO KAZUNORI |
分类号 |
H01R43/00;H01B5/00 |
主分类号 |
H01R43/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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