发明名称 |
STACKED PACKAGE STRUCTURE FOR REDUCING PACKAGE VOLUME OF AN ACOUSTIC MICRO-SENSOR |
摘要 |
A stacked package structure utilizes flip-chip technology to stack an acoustic micro-sensor on an integrated circuit (IC) device having a recess as a back chamber and cover the acoustic micro-sensor using a glass substrate or a planar substrate with an aperture. With the use of the stacked package structure, the package volume of the acoustic micro-sensor can be reduced effectively.
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申请公布号 |
US2009057876(A1) |
申请公布日期 |
2009.03.05 |
申请号 |
US20080119551 |
申请日期 |
2008.05.13 |
申请人 |
INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE |
发明人 |
CHIEN HSIN-TANG;HSIAO CHIEH-LING;WANG CHIN-HUNG |
分类号 |
H01L23/13 |
主分类号 |
H01L23/13 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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