METHOD FOR IMPROVING QUALITY OF SPALLED MATERIAL LAYERS

摘要

Methods for removing a material layer from a base substrate utilizing spalling in which mode III stress, i.e., the stress that is perpendicular to the fracture front created in the base substrate, during spalling is reduced. The substantial reduction of the mode III stress during spalling results in a spalling process in which the spalled material has less surface roughness at one of its' edges as compared to prior art spalling processes in which the mode III stress is present and competes with spalling.

主权项

1. A method of removing a material layer from a base substrate, said method comprising:
providing a stressor layer with uniaxial stress atop a base substrate having a fracture toughness that is less than that of said stressor layer, wherein said providing said stressor layer with uniaxial stress comprises forming a material having intrinsic uniaxial stress atop said base substrate; and spalling a material layer from said base substrate.