发明名称 |
BENZOXAZINE COMPOUND, BENZOXAZINE RESIN, METHOD OF PRODUCING BENZOXAZINE RESIN, CURABLE RESIN COMPOSITION, CURED ARTICLE HEREOF, FRP MATERIAL, SEMICONDUCTOR ENCAPSULATION MATERIAL, VARNISH, CIRCUIT BOARD, PREPREG AND BUILD-UP FILM |
摘要 |
PROBLEM TO BE SOLVED: To provide a benzoxazine compound and a benzoxazine resin each of which provides a cured article excellent in various properties of heat resistance, resistance to pyrolysis, fire retardancy and dielectric property, and to provided a method of producing the benzoxazine resin, a curable resin composition, the cured article thereof, an FRP material, a semiconductor encapsulation material, a varnish, a circuit board, a prepreg and a build-up film.SOLUTION: There is provided the benzooxazine compound obtained by reacting a phenol compound having a molecular structure represented by the formula (I), with a monoamine compound and formaldehyde. HO-X-OH(I) [in the formula (I), X is a structural site represented by the following formula (x1) or (x2) ].SELECTED DRAWING: None |
申请公布号 |
JP2016113549(A) |
申请公布日期 |
2016.06.23 |
申请号 |
JP20140253998 |
申请日期 |
2014.12.16 |
申请人 |
DIC CORP |
发明人 |
TAKAHASHI AYUMI;SATO YASUSHI |
分类号 |
C08G14/073;C08J5/24;C08K3/00;C08L61/34;H05K1/03 |
主分类号 |
C08G14/073 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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