PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR PRODUCING STRUCTURE

摘要

A photosensitive resin composition containing a binder polymer, a photopolymerizable compound, and a photopolymerization initiator, wherein the photopolymerizable compound contains a compound represented by general formula (1), and a compound having one ethylenically unsaturated bond per molecule. (In formula (1), R11 represents a C1-20 alkylene group, a C1-10 cycloalkylene group, or a phenylene group. R12 and R13 each independently represent a hydrogen atom or a methyl group. X11 and X12 each independently represent an oxyalkylene group or polyoxyalkylene group containing at least one or more types selected from a group consisting of an oxyethylene group and an oxypropylene group. The total number of oxypropylene groups and oxyethylene groups contained in X11 and X12 is 12-80.)