| 摘要 |
According to various embodiments of the present invention, an electronic device comprises: a first cover forming one surface of an electronic device; a second cover forming an opposing surface of the one surface; a printed circuit board (PCB) which is arranged between the first cover and the second cover, and comprises a first surface facing the first cover, a second surface facing the second cover, and a side surface; at least one electronic component arranged on the first surface in proximity to a portion of the side surface; a shield structure comprising a cap arranged between the first cover and the first surface to cover the electronic component, and a side wall extended from a periphery of the cap towards the first surface; a first conductive structure formed on a portion of the side surface of the PCB; and a second conductive structure which is disposed on a portion of the first surface of the PCB, is connected to the first conductive structure, and has a surface directed towards the first cover. The side wall is extended in a first direction non-parallel with the surface, and includes a portion coming in contact with the surface. The portion of the side wall coming in contact with the surface can be overlapped with the second conductive structure when viewed from above the first surface of the PCB. |
