发明名称 SEMICONDUCTOR STRUCTURE AND PROCESS THEREOF
摘要 A semiconductor process includes the following step. A metal gate strip and a cap layer are sequentially formed in a trench of a dielectric layer. The cap layer and the metal gate strip are cut off to form a plurality of caps on a plurality of metal gates, and a gap isolates adjacent caps and adjacent metal gates. An isolation material fills in the gap. The present invention also provides semiconductor structures formed by said semiconductor process. For example, the semiconductor structure includes a plurality of stacked structures in a trench of a dielectric layer, where each of the stacked structures includes a metal gate and a cap on the metal gate, where an isolation slot isolates and contacts adjacent stacked structures at end to end, and the isolation slot has same level as the stacked structures.
申请公布号 US2016300755(A1) 申请公布日期 2016.10.13
申请号 US201514711777 申请日期 2015.05.14
申请人 UNITED MICROELECTRONICS CORP. 发明人 Gan Tian Choy;Hsiao Chu-Yun;Huang Chun-Che;Hsu Chia-Fu
分类号 H01L21/762;H01L21/02;H01L29/423;H01L21/768 主分类号 H01L21/762
代理机构 代理人
主权项 1. A semiconductor process, comprising: forming a metal gate strip in a trench of a dielectric layer; forming a cap layer on the metal gate strip; cutting off the cap layer and the metal gate strip to form a plurality of caps on a plurality of metal gates, and to have a gap separating adjacent caps and adjacent metal gates; and filling an isolation material in the gap after the cap layer and the metal gate strip are cut off.
地址 Hsin-Chu City TW