发明名称 MULTILAYER STRUCTURE AND TOUCH PANEL MODULE
摘要 A multilayer structure has a laminate including a transparent conductive member having a conductive pattern having a mesh structure composed of thin metal wires on a transparent substrate having flexibility, a protective member for protecting the transparent conductive member, and an optically transparent adhesive layer disposed between the transparent conductive member and the protective member. The thickness of the laminate is 100 μm or more and 600 μm or less. The thickness of the adhesive layer is 20% or more of the thickness of the laminate. The thermal shrinkage of the transparent conductive member at 150° C. is 0.5% or less, and a difference between the thermal shrinkage of the transparent conductive member and the thermal shrinkage of the protective member at 150° C. is within 60% of the thermal shrinkage of the transparent conductive member at 150° C. The multilayer structure is used for a touch panel module having a three-dimensional shape.
申请公布号 US2016334896(A1) 申请公布日期 2016.11.17
申请号 US201615218518 申请日期 2016.07.25
申请人 FUJIFILM Corporation 发明人 KOIKE Takashi;KOBAYASHI Hiroyuki;NISHIDA Tetsuji;TSUBATA Hisashi
分类号 G06F3/041;B32B27/36;B32B7/02;B32B7/12;B32B27/08 主分类号 G06F3/041
代理机构 代理人
主权项 1. A multilayer structure comprising: a laminate comprising a transparent conductive member having a conductive pattern having a mesh structure composed of thin metal wires on a transparent substrate having flexibility,a protective member for protecting the transparent conductive member, andan optically transparent adhesive layer disposed between the transparent conductive member and the protective member, wherein the thickness of the laminate is 100 μm or more and 600 μm or less, the thickness of the adhesive layer is 20% or more of the thickness of the laminate, the thermal shrinkage of the transparent conductive member at 150° C. is 0.5% or less, and a difference between the thermal shrinkage of the transparent conductive member and the thermal shrinkage of the protective member at 150° C. is within 60% of the thermal shrinkage of the transparent conductive member at 150° C.
地址 Tokyo JP