| 发明名称 |
COMPONENT PART HAVING A MECS COMPONENT ON A MOUNTING CARRIER |
| 摘要 |
A packaging technology for MECS components, which allows the realization of extremely robust components which are resistant to high temperatures and media. Such a component includes at least one micro-electrochemical sensor (MECS) component having a diaphragm, which is developed in a layer construction on the substrate of the component and spans an opening in the substrate rear side, and a carrier for the mounting and electrical contacting of the MECS component on an application circuit board. The MECS component is bonded to the carrier in flip chip technology, so that a hermetically tight mechanical connection between the top surface of the MECS component and the carrier surface exists at least in one connection region, and an electric connection between the MECS component and the carrier exists in at least one contact area. |
| 申请公布号 |
US2016341689(A1) |
申请公布日期 |
2016.11.24 |
| 申请号 |
US201615156856 |
申请日期 |
2016.05.17 |
| 申请人 |
Robert Bosch GmbH |
发明人 |
Guenschel Roland;Guenschel Harald;Diehl Lothar;Schneider Gerhard |
| 分类号 |
G01N27/407;G01N27/406;B81B3/00 |
主分类号 |
G01N27/407 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A component, comprising:
a micro-electrochemical sensor (MECS) component having a diaphragm which is developed in a layer construction on a substrate of the component and spans an opening in the substrate rear side; and a carrier for mounting and electrical contacting of the MECS component on an application circuit board, the MECS component being bonded to the carrier via flip chip technology so that a hermetically tight mechanical connection between a top surface of the MECS component and a surface of the carrier exists at least in one connection region, and an electric connection between the MECS component and the carrier exists in at least one contact area. |
| 地址 |
Stuttgart DE |
