| 摘要 |
PROBLEM TO BE SOLVED: To improve mounting of electronic circuit components (simply called "components" hereafter) onto a plurality of boards while using a mounting head in which a plurality of suction nozzles are held.SOLUTION: For example, when mounting components on two circuit boards, after components are completely mounted onto one board, components are mounted onto the other board. For example, when mounting five components of the same kind onto one board by means of a mounting head including four suction nozzles of the same kind, the mounting head makes all the suction nozzles hold the components each time a sucking and mounting operation is performed, mounts four components on the first board when performing the first sucking and mounting operation, mounts one of the four components onto the first board when performing the second sucking and mounting operation, mounts three components onto the second board and mounts two of the four components on the second board when performing a third sucking and mounting operation. When mounting components onto two board, it is completed by three times of sucking and mounting operations, and the number of times of operations is reduced in comparison with the prior arts where component mounting was performed for the unit of a board and the sucking and mounting operation is repeated four times. |
