发明名称 COOLING MODULE AND ELECTRONIC DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a technology which enables easy control of an elastic force occurring in a leaf spring as one aspect.SOLUTION: A cooling module 18 includes a heat exchanger 20, an H-shaped leaf spring 60, and support pillars 74. The heat exchanger 20 is installed on an electronic component 14 mounted on a substrate 12 and cools the electronic component 14. The H-shaped leaf spring 60 has protruding parts 68 and extending parts 70. Each protruding part 68 protrudes from the heat exchanger 20 to the outside of the heat exchanger 20. When viewed from a thickness direction of the substrate 12, each extending part 70 extends from the protruding part 68 in an intersection direction which intersects with a protruding direction of the protruding part 68. The support pillars 74 are disposed at an outer periphery of the heat exchanger 20 and fixed to the substrate 12. The extending parts 70 deflected to the substrate 12 side are attached to the support pillars 74.SELECTED DRAWING: Figure 5
申请公布号 JP2016213314(A) 申请公布日期 2016.12.15
申请号 JP20150095497 申请日期 2015.05.08
申请人 FUJITSU LTD 发明人 SHINOBE KENJI;KUBO HIDEO;SO TAKESHI;AOKI NOBUMITSU;WATANABE MASAYUKI;TAWA FUMIHIRO;UZUKA YOSHINORI
分类号 H01L23/40;F28D15/02;H05K7/20 主分类号 H01L23/40
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