| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a multilayer wiring board by which positional deviation between layers can be sufficiently suppressed by causing a resin composition which constitutes a prepreg to obtain sufficient welding strength at the time of temporary welding in the case that the resin composition has a welding start temperature of around 110°C and has a curing start temperature of around 150°C like a PPO modified epoxy resin composition, in obtaining the multilayer wiring board by a method wherein, after partial temporary welding the laminate of a wiring board and the prepreg, the entire laminate is integrally formed into one body under heat and pressure. SOLUTION: The prepreg 1 consists of a substrate and the resin composition which has a melting start temperature of 110±15°C and a curing start temperature of 150±15°C. The heating temperature of the prepreg 1 by means of a jig 3 for welding at the time of temporary welding is set to 250-280°C, and a heating time is set to 40-90 sec. By this method, at the time of temporary welding, the resin composition which constitutes the prepreg 1 is caused to sufficiently flow, and a curing reaction of the resin composition progresses after it sticks tightly to the adjacent wiring board 2, resulting in obtaining excellent adhesion strength at the time of temporary welding. COPYRIGHT: (C)2005,JPO&NCIPI |
