| 摘要 |
One embodiment of the present invention provides an integrated chip module and a corresponding method of manufacture that facilitates proximity communication. This module includes a base chip and a bridge chip, both of which include an active face, upon which active circuitry and signal pads reside, and a back face opposite the active face. The active face of the bridge chip is bonded to the active face of the base chip, and the back face of the bridge chip is thinned via planarization or polishing. |
