| 摘要 |
A grease includes: (A) 2 to 50 weight %, based on the weight of the grease, of a polyorganosiloxane having an average, per molecule, of at least one silicon-bonded hydrocarbonoxy-functional group; and (B) 50 to 98 weight %, based on the weight of the grease, of at least one thermally conductive filler. The grease may be used as a thermal interface material for dissipating heat from electronic devices. |
