| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To achieve multi-layering of mother board, which is not extended entirely on one face side of the mother board, but is limited to a packaging portion of an electronic part in an electronic device equipped with the electronic part on one face of the mother board. <P>SOLUTION: The electronic device includes a mother board 10 and an electronic part 30 mounted on the side of one face 11 of the mother board 10. On part of the side of the one face 11 of the mother board 10, a wiring member 20 in layered state is mounted, and the electronic part 30 is connected electrically/mechanically to the mother board 10 through the wiring member 20. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
