发明名称 |
COMMON MODE FILTER |
摘要 |
The present invention relates to a common mode filter capable of increasing adhesion between coil layers, which comprises: a coil unit having a coil formed in one surface, and having a plurality of insulating layers including fillers stacked therein; a first cover unit arranged in a lower part of the coil unit; a second cover unit arranged in an upper part of the coil unit; and a surface modification layer for increasing adhesion between the insulating layers on at least one surface of the insulating layer. |
申请公布号 |
KR20160064971(A) |
申请公布日期 |
2016.06.08 |
申请号 |
KR20150156709 |
申请日期 |
2015.11.09 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
PARK, SEUNG WOOK;SIM, WON CHUL |
分类号 |
H01F17/00;H01F27/29;H01F27/32;H01F27/34 |
主分类号 |
H01F17/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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