发明名称 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
摘要 In a semiconductor device, a region where a channel is formed is protected. In a semiconductor device, a region protecting a region where a channel is formed is provided in a semiconductor layer. In a semiconductor device, a layer protecting a region where a channel is formed is provided. In a semiconductor device, a region and/or a layer protecting a region where a channel is formed have/has a low density of defect states. In a semiconductor device, a region where a channel is formed has a low density of defect states.
申请公布号 US2016254295(A1) 申请公布日期 2016.09.01
申请号 US201615151541 申请日期 2016.05.11
申请人 SEMICONDUCTOR ENERGY LABORATORY CO., LTD. 发明人 YAMAZAKI Shunpei
分类号 H01L27/12;H01L29/24;H01L29/66;G02F1/1343;G02F1/1341;G02F1/1362;G02F1/1333;H01L29/786;G02F1/1368 主分类号 H01L27/12
代理机构 代理人
主权项 1. A method for manufacturing a semiconductor device comprising the steps of: forming a gate electrode; forming a gate insulating film over the gate electrode; forming a first oxide semiconductor layer over the gate insulating film and forming a second oxide semiconductor layer over the first oxide semiconductor layer, forming a conductive film over the second oxide semiconductor layer; and partly etching the conductive film to expose a part of the second oxide semiconductor layer, wherein the part of the second oxide semiconductor layer is etched so that a thickness of the part of the second oxide semiconductor layer is greater than or equal to 0 nm and less than 5 nm.
地址 Atsugi-shi JP