发明名称 |
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF |
摘要 |
In a semiconductor device, a region where a channel is formed is protected. In a semiconductor device, a region protecting a region where a channel is formed is provided in a semiconductor layer. In a semiconductor device, a layer protecting a region where a channel is formed is provided. In a semiconductor device, a region and/or a layer protecting a region where a channel is formed have/has a low density of defect states. In a semiconductor device, a region where a channel is formed has a low density of defect states. |
申请公布号 |
US2016254295(A1) |
申请公布日期 |
2016.09.01 |
申请号 |
US201615151541 |
申请日期 |
2016.05.11 |
申请人 |
SEMICONDUCTOR ENERGY LABORATORY CO., LTD. |
发明人 |
YAMAZAKI Shunpei |
分类号 |
H01L27/12;H01L29/24;H01L29/66;G02F1/1343;G02F1/1341;G02F1/1362;G02F1/1333;H01L29/786;G02F1/1368 |
主分类号 |
H01L27/12 |
代理机构 |
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代理人 |
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主权项 |
1. A method for manufacturing a semiconductor device comprising the steps of:
forming a gate electrode; forming a gate insulating film over the gate electrode; forming a first oxide semiconductor layer over the gate insulating film and forming a second oxide semiconductor layer over the first oxide semiconductor layer, forming a conductive film over the second oxide semiconductor layer; and partly etching the conductive film to expose a part of the second oxide semiconductor layer, wherein the part of the second oxide semiconductor layer is etched so that a thickness of the part of the second oxide semiconductor layer is greater than or equal to 0 nm and less than 5 nm. |
地址 |
Atsugi-shi JP |