| 摘要 |
PROBLEM TO BE SOLVED: To provide a processing method that can accurately process a wafer into a circular shape.SOLUTION: A processing method includes a cutting mark formation step of forming a cutting mark by aligning a reference line to an annular region to have a cutting blade cut out a wafer, a positional deviation detection step of detecting a positional deviation amount and a positional deviation direction between a wafer center side edge or a wafer anti-center side edge of the cutting mark and the reference line, and a circular processing step of after performing the positional deviation detection step, taking a picture of a wafer with imaging means to locate the reference line to the circular region while adding a positional deviation correction value of a same amount as the positional deviation amount to positional date of the cutting blade in an opposite direction to the positional deviation direction to perform a position correction of the cutting blade and having the cutting blade cut out the wafer, then rotating a holding table for one rotation or more to cut out the wafer into a circular shape. |
