发明名称 FLEXIBLE SUBSTRATE, ELECTRONIC EQUIPMENT, AND METHOD FOR MANUFACTURING ELECTRONIC EQUIPMENT
摘要 PROBLEM TO BE SOLVED: To provide a flexible substrate capable of suppressing changes in characteristics accompanying deformation by a simple configuration, electronic equipment including the flexible substrate, and a method for manufacturing the same.SOLUTION: Electronic equipment comprises circuit boards 201 and 202, a flexible substrate 101A mounted on the circuit boards 201 and 202, and an electronic component 31. The flexible substrate 101A comprises a deformable base material 10, a first connection part (first connector 51) formed on the base material 10, a second connection part (second connector 52), and an electronic component connection part arranged between the first connection part and the second connection part. The electronic component 31 comprises a first terminal P1 and a second terminal P2 on the surfaces facing each other. The first terminal P1 is connected to the electronic component connection part, and the second terminal P2 is connected to a conductor 74 formed on the circuit board. A gap D1 is formed between the flexible substrate 101A and the circuit board 201. The electronic component 31 secures the gap D1.SELECTED DRAWING: Figure 3
申请公布号 JP2016213310(A) 申请公布日期 2016.12.15
申请号 JP20150095378 申请日期 2015.05.08
申请人 MURATA MFG CO LTD 发明人 BABA TAKAHIRO
分类号 H05K1/14;H05K3/36 主分类号 H05K1/14
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