PACKAGING STRUCTURE OF LIGHT EMITTING DIODES AND METHOD THEREFOR

摘要

A packaging method for light emitting diodes and structure thereof are provided, more particularly, provided are packaging method and structure thereof, which innovates packaging processes in fabrication distinct from and even contrary to those of conventional technologies, and obviate required Gold Wire Bonding Processes traditionally. The method comprises steps of: (A) preparing a transparent substrate with high transparency, (B) providing an optoelectronic semiconductor chip on a surface of the transparent substrate the optoelectronic semiconductor chip being provided with a light-emitting face and at least two electrodes, wherein a light emitted from the optoelectronic semiconductor chip penetrates through the transparent substrate, (C) providing an insulating layer on the transparent substrate, so as to partially overlay on the at least two electrodes, the optoelectronic semiconductor chip and the transparent substrate, and (D) and the at least two metal soldering pads being electrically connected with the at least two electrodes respectively.

主权项

1. A packaging structure of light emitting diodes, comprising:
a transparent substrate; an optoelectronic semiconductor chip, provided with a light-emitting face and at least two electrodes, said at least two electrodes being provided on an opposite surface to an adjoining surface of said optoelectronic semiconductor chip and said transparent substrate, said light-emitting face being placed on said adjoining surface of said optoelectronic semiconductor chip and said transparent substrate; an insulating layer, being provided on said transparent substrate, partially overlaid said at least two electrodes, said optoelectronic semiconductor chip and said transparent substrate; and at least two metal soldering pads, being provided separately on said at least two electrodes, and electrically connected with said at least two electrodes respectively, wherein a light emitted from said optoelectronic semiconductor chip penetrates through said transparent substrate.