| 发明名称 |
LED Packaging Structure And Method For Manufacturing The Same |
| 摘要 |
An LED package having a substrate, an LED chip, a phosphor sheet and a first resin is provided. The LED chip is disposed on the substrate. The phosphor sheet has a first area, and is affixed on a first surface of the LED chip. The first resin is disposed on the substrate for covering the LED chip along with the phosphor sheet, with at least a part of the phosphor sheet being exposed. |
| 申请公布号 |
US2016225959(A1) |
申请公布日期 |
2016.08.04 |
| 申请号 |
US201615014356 |
申请日期 |
2016.02.03 |
| 申请人 |
Everlight Electronics Co., Ltd. |
发明人 |
Pan Ke-Hao;Wu Chi-Ming |
| 分类号 |
H01L33/50;H01L29/866;H01L33/56;H01L25/16 |
主分类号 |
H01L33/50 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A light emitting diode (LED) package, comprising:
a substrate; an LED chip disposed on the substrate; an adhesive; a phosphor sheet having a first area and affixed on an upper surface of the LED chip via the adhesive; and a first resin disposed on the substrate and adapted to surround a periphery of the LED chip and a periphery of the phosphor sheet to expose at least a part of the phosphor sheet, wherein a diffusion area of the adhesive is not larger than an area of the upper surface of the LED chip when the phosphor sheet is affixed on the LED chip via the adhesive. |
| 地址 |
New Taipei City TW |
