SEMICONDUCTOR PACKAGES, METHODS OF FABRICATING THE SAME, MEMORY CARDS INCLUDING THE SAME AND ELECTRONIC SYSTEMS INCLUDING THE SAME

摘要

A semiconductor package includes a package substrate having a cavity therein and a second internal contact portion, a semiconductor die disposed in the cavity of the package substrate and having a first internal contact portion, a bonding wire connecting the first internal contact portion to the second internal contact portion, and an encapsulation part covering surfaces of the semiconductor die and the package substrate and providing an opening that exposes a first external contact portion of the bonding wire. Related memory cards and related electronic systems are also provided.

主权项

1. A semiconductor package comprising:
a package substrate having a cavity and a second internal contact portion, wherein the cavity penetrates the package substrate; a semiconductor die disposed in the cavity of the package substrate, the semiconductor die having a first internal contact portion, wherein the semiconductor die has a first surface and a second surface opposite to the first surface, wherein the first surface is exposed by the package substrate, and wherein the second surface is fully exposed by the package substrate; a bonding wire connecting the first internal contact portion to the second internal contact portion; and an encapsulation part covering the first surface of the semiconductor die and a third surface of the package substrate and having an opening that exposes a first external contact portion of the bonding wire.