| 摘要 |
Provided is a semiconductor device capable of reducing its size, increasing its packing density, preventing a deterioration in circuit characteristics, and increasing flexibility in wiring design. The semiconductor device comprises a chip core region and an IO region on a semiconductor substrate. In the chip core region, a large number of circuits (20) are arranged. In the IO region, a ring wiring (60) of a laminated structure with a top layer (61) corresponding to a first potential, and a bottom layer (62) corresponding to a second potential is provided. The top layer (61) of the ring wiring (60) and the circuits (20) are connected via first connecting lines (16), and the bottom layer (62) and the circuits (20) are connected via second connecting lines (17), so electric power is supplied to the circuits. <IMAGE> |
