发明名称 RESISTANCE RAM DEVICE AND METHOD OF MANUFACTURING THE SAME
摘要 <p>PURPOSE: A resistance RAM device and a method for manufacturing the same are provided to minimize the current path between the bottom electrode contact and the binary oxide film by forming the bottom electrode contact by vertically growing up the carbon nanotube. CONSTITUTION: A switching element(110) is formed on the semiconductor substrate. A bottom electrode contact(122) is connected to the switching element electrically and includes the carbon nanotube. The binary oxide film is formed on the bottom electrode contact and stores the information according to two resistive states. The upper electrode is formed on the binary oxide film. The metal wiring is contacted with the upper electrode.</p>
申请公布号 KR20090126676(A) 申请公布日期 2009.12.09
申请号 KR20080052888 申请日期 2008.06.05
申请人 HYNIX SEMICONDUCTOR INC. 发明人 HWANG, YUN TAEK
分类号 H01L27/115;H01L21/8247 主分类号 H01L27/115
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