摘要 |
A method for producing a polishing compound, which comprises dissolving a heterocyclic benzene compound such as benzotriazole in one or more organic solvents selected from the group consisting of a primary alcohol having 1 to 4 carbon atoms, a glycol having 2 to 4 carbon atoms, an ether represented by CHCH(OH) CHOCH, wherein m is an integer of 1 to 4, N-methyl-2-pyrrolidone, N,N-dimethylformamide, dimethyl sulfoxide, γ-butyloractone and propylene carbonate, and then mixing the resulting solution with an aqueous dispersion of fine oxide particles as abrasive grains; and a polishing compound produced by the method. The use of the polishing compound for polishing a substrate having an insulating film (2) and, formed thereon, a wiring metal film (4) and a barrier film (3) allows the formation of an embedded wiring (5) being reduced in dishing, in erosion, and in scratch, with high polishing speed.
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