| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide electronic equipment in which a substrate mounted with a heat source fitted with a heat transmission portion can be made compact. <P>SOLUTION: A projection 65 of a coupling member 56b of a frame 56 is fit in a cut hole 49 of a main board 41, and the frame 56 and a frame 76 are positioned and fixed at a first position P1. A projection 85 of a coupling member 52c of a frame 52 is inserted into a through-hole 48 of the body 41, and the frame 52 and a coupling member 75c are fixed at a second position P2. A projection 83 of a coupling member 52b is inserted into a hole 63 of a cooling module body 55, and the frame 52 and a coupling member 75b are fixed at a third position P3. The projection 83 of the coupling member 52b is fixed in a through-hole 77 of the coupling member 75b at the third position P3 outside the body 41. Consequently, the hole into which the projection 83 is inserted need not be formed in the main board 41, which is made compact. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
