| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To divert a package substrate to an adapter board. <P>SOLUTION: The semiconductor device 3 includes the package substrate 300 having an upper surface 3a and a lower surface 3b, and a semiconductor element 30 mounted on the upper surface 3a of the package substrate 300. The package substrate 300 includes pads 303, 903 arranged on the upper surface 3a, a pad 904 arranged on the lower surface 3b, and a test dedicated pad 905 arranged on the lower surface 3b. The semiconductor element 30 is connected to the pad 303 and a test dedicated pad 903, respectively. An external connection terminal 401 is provided at the pad 904, and the external connection terminal 401 is not provided at the test dedicated pad 905. The pitch of the pad 904 is wider than that of the pad 303. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
