发明名称 DOUBLE-SIDED ADHESIVE TAPE AND ELECTRONIC DEVICE
摘要 There is provided a double-sided pressure-sensitive adhesive tape including resin films laminated on both surfaces of a foaming body substrate, and pressure-sensitive adhesive layers laminated on the surface of the resin film, in which the foaming body substrate has a density of 0.45 g/cm3 or less, and an interlaminar strength of 10 N/cm or more, and pressure-sensitive adhesive layer exhibits a 180° peeling adhesive force of 10 N/20 mm or more when a pressure-sensitive adhesive tape obtained by providing the pressure-sensitive adhesive layer on a polyethylene terephthalate substrate having a thickness of 25 μm such that the thickness of the pressure-sensitive adhesive layer is 25 μm is allowed to adhere onto an aluminum plate with pressure under the predetermined environment, and is peeled at a peeling rate of 300 mm/min.
申请公布号 US2016339672(A1) 申请公布日期 2016.11.24
申请号 US201415108130 申请日期 2014.12.09
申请人 DIC CORPORATION 发明人 Kagiyama Yumi;Takei Hideaki;Yamakami Akira;Iwasaki Takeshi
分类号 B32B5/24;C09J175/04;C09J7/02;B32B7/12;B32B27/36 主分类号 B32B5/24
代理机构 代理人
主权项 1. A double-sided pressure-sensitive adhesive tape comprising: resin films laminated on both surfaces of a foaming body substrate; and pressure-sensitive adhesive layers laminated on the surface of the respective resin films, wherein the foaming body substrate is a foaming body substrate having a density of 0.45 g/cm3 or less and an interlaminar strength of 10 N/cm or more, and the pressure-sensitive adhesive layer is a pressure-sensitive adhesive layer which exhibits a 180° peeling adhesive force 10 N/20 mm or more, when a pressure-sensitive adhesive tape obtained by providing the pressure-sensitive adhesive layer on a polyethylene terephthalate substrate having a thickness of 25 μm such that the thickness of the pressure-sensitive adhesive layer is 25 μm is rolled reciprocatively once on an aluminum plate with a 2 kg roller under the environment of a temperature of 23° C. and a relative humidity of 65% RH such that the pressure-sensitive adhesive tape adheres to the aluminum plate with pressure, is left to stand for one hour under the environment of a temperature of 23° C. and a relative humidity of 50% RH, and is then peeled at a peeling rate of 300 mm/min.
地址 Tokyo JP