| 摘要 |
PROBLEM TO BE SOLVED: To prevent noises caused by semiconductor chip operation.SOLUTION: The electronic apparatus includes: a function module formed by mounting a semiconductor chip on a first wiring substrate; and a second wiring substrate, to which a plurality of the function modules that are parallely arranged is connected, having a layer composed of a thin film capacitor. The thin film capacitor is arranged across the plurality of parallely arranged function modules. The present invention can be applied to a wearable devices or IoT(Internet of Things) devices, for instance.SELECTED DRAWING: Figure 1 |
