发明名称 LED DEVICE AND MANUFACTURING METHOD THEREOF
摘要 <P>PROBLEM TO BE SOLVED: To provide an LED device in which failure in mounting a reflector can be reduced, and a manufacturing method thereof. <P>SOLUTION: A lower end portion 22b is caulked to a lower end edge 4c with a caulking punch 26 in a state in which a sword guard 23 of the reflector 22 is pressed on an upper end edge 4b of a first through hole 4 of a printed wiring board 12 with a caulking receiving punch 27. An external peripheral surface 22a of the center of the reflector 22 bulges in a surface direction of the printed wiring board 12, and closely adheres on an internal peripheral surface 4a of the first through hole 4. At the same time, the external peripheral surface of the lower edge portion 22b bulges in a surface direction of the printed wiring board 12, and a bulging portion 22c bulging in a diameter direction from a diameter R1 of the first through hole 4 is formed. <P>COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2006344772(A) 申请公布日期 2006.12.21
申请号 JP20050169204 申请日期 2005.06.09
申请人 HITACHI AIC INC 发明人 YOSHIDA HIDEKI;SUGIURA RYOJI;SAKURAI MASAYUKI
分类号 H01L33/54;H01L33/56;H01L33/60;H01L33/62 主分类号 H01L33/54
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